TSMC Kumamoto Second Wafer Fab Delay, Production Set for 2027

TSMC's Japanese subsidiary, Japan Advanced Semiconductor Manufacturing (JASM), has announced plans to construct a second semiconductor wafer fab in Kumamoto. The construction is set to begin in 2025, potentially later than initially anticipated, although the plant is still expected to begin production by the end of 2027.

The new facility will be located to the east of the first plant, covering an area of 321,000 square meters. The investment is estimated at 2.1 trillion yen (approximately $14.04 billion), and the plant will focus on manufacturing chips using 6nm process technology. Yuichi Horita, President of JASM, confirmed during the Kumamoto Industrial Revitalization Expo in 2025 that, despite potential delays in construction, the production schedule for the new plant remains on track.

JASM's first Kumamoto fab began mass production in 2024 and is planned for capacity expansion. Horita emphasized the company's goal to increase Japan's domestic semiconductor material procurement rate to 60% by 2030. He also highlighted that advanced materials partners will invest in new production lines, and expressed a desire for greater collaboration between Taiwanese manufacturers and local Kumamoto companies.