MediaTek Unveils Dimensity 7400, 7400X, and 6400 Chips

On February 25, MediaTek introduced three new mobile chips: the Dimensity 7400, Dimensity 7400X, and Dimensity 6400. These advanced, energy-efficient chips further expand MediaTek’s Dimensity mobile platform portfolio. The Dimensity 7400 and 7400X offer cutting-edge gaming and AI camera technology, while the Dimensity 6400 delivers excellent performance with enhanced 5G capabilities at a more affordable price point. Following the Dimensity 9400 and 8400, these latest chips provide outstanding performance for high-end and mainstream mobile devices.

The Dimensity 7400 and 7400X feature an 8-core CPU, including 4 Arm Cortex-A78 cores running at up to 2.6GHz and 4 Arm Cortex-A55 cores at up to 2.0GHz, alongside an Arm Mali-G615 MC2 GPU. Built on TSMC's 4nm process, the Dimensity 7400 series is designed for high energy efficiency, reducing gaming power consumption by 14%-36% compared to similar products. Additionally, both chips support MediaTek's HyperEngine 3.0, enhancing graphics performance and utilizing AI to optimize gaming settings based on device load. These features also help minimize input latency, delivering quicker response times while advanced power-saving modes ensure extended playtime.

The Dimensity 7400 series incorporates MediaTek's NPU 655, providing a 15% improvement in AI performance over the previous generation, Dimensity 7300. Its high-end Imagiq 950 ISP (Image Signal Processor) delivers exceptional multimedia capabilities, supporting advanced AI camera features to capture clear images even in low-light conditions. The chips also support Google Ultra HDR, offering higher dynamic range, vivid colors, and improved contrast for both photos and videos.

Key features of the Dimensity 7400 series include:

· The Dimensity 7400X supports dual-screen displays, making it ideal for foldable devices.

· Integrated 5G R16 modem with support for 3CC-CA (Triple Carrier Aggregation).

· MediaTek's UltraSave 3.0+ power-saving technology, reducing power consumption by up to 20% compared to similar products.

· Support for tri-band Wi-Fi 6E, providing fast and reliable multi-gigabit wireless network connectivity.

As the newest addition to the Dimensity 6000 series, the Dimensity 6400 brings advanced 5G connectivity features to a wider global audience. Its 8-core CPU includes 2 Arm Cortex-A76 cores clocked up to 2.5GHz and 6 Arm Cortex-A55 cores at up to 2.0GHz, paired with an Arm Mali-G57 MC2 GPU. Built on TSMC's 6nm process, the Dimensity 6400 offers up to 19% lower gaming power consumption compared to competitors.

Key features of the Dimensity 6400 include:

· MediaTek Wi-Fi Bluetooth HyperConnect technology reduces latency by 90%, delivering a smoother gaming experience.

· Integrated 5G R16 modem with 2CC-CA (Dual Carrier Aggregation) support.

· 33% faster downlink and 18% faster uplink speeds compared to similar products.

· Support for 1 billion color displays and 10-bit image and video rendering for vivid visuals; True Color Accuracy technology ensures precise color reproduction.

Support for a main camera with up to 108MP, featuring MediaTek’s collaboration with ArcSoft for Multi-Frame Noise Reduction (MFNR) and Low Power Noise Reduction (LPNR) technologies, resulting in clearer selfies and portrait shots.

Smartphones featuring the MediaTek Dimensity 7400 and 7400X chips are expected to launch in the first quarter of 2025, while devices with the Dimensity 6400 are already available.