Qualcomm Snapdragon X2 Chipset Revealed: 18 Oryon V3 Cores

According to a report by WinFuture, citing German media, Qualcomm's upcoming Snapdragon X2 processor for Windows PCs will feature up to 18 Oryon V3 CPU cores, marking a 50% increase over the first-generation Snapdragon X processors. This significant upgrade could position Qualcomm to further expand its presence in the high-end laptop market.

Previous reports indicated that Qualcomm had already completed testing on the Snapdragon X2 chip, codenamed Project Glymur, with the model number SC8480XP. WinFuture's latest report confirms this information, revealing key technical specifications of the chip.

The Snapdragon X2 will feature a maximum of 18 Oryon V3 cores and will be packaged using System-in-Package (SiP) technology, integrating 48GB of SK hynix memory chips. Additionally, the chip will come with a 1TB onboard SSD. However, the specific AI performance capabilities of the Snapdragon X2 remain unclear at this time.

It's important to note that, due to the increased number of CPU cores, the Snapdragon X2's power consumption is expected to rise. The TDP is anticipated to exceed 80W, compared to its predecessor, but this increase will likely come with substantial performance improvements.

WinFuture also suggests that the upcoming chip may fall under the "Snapdragon X2 Ultra Premium" brand, further solidifying Qualcomm's ambitions in the high-performance PC market.