Broadcom, NVIDIA, and AMD Testing Intel 18A Process

According to Reuters, industry sources report that NVIDIA and Broadcom are conducting manufacturing tests using Intel's latest Intel 18A process, signaling initial confidence in the company's advanced production technology.

Additionally, AMD is evaluating whether the Intel 18A process meets its requirements, though it remains unclear if test chips have been sent to fabrication facilities.

NVIDIA, Broadcom, and AMD rank among the top five global chip design firms. If they proceed with Intel 18A for their semiconductor production, it could mark a significant turning point for Intel's wafer fabrication business.

Responding to these reports, an Intel spokesperson stated: "We do not comment on specific customers, but Intel 18A continues to attract strong interest and broad engagement across the ecosystem."

Last year, Korean media reported that Intel 18A had a yield rate of only 10%, sparking industry-wide discussions and claims that Broadcom might have canceled its collaboration with Intel. However, renowned analyst Patrick Moorhead and former Intel CEO Pat Gelsinger later refuted these claims on X. Gelsinger emphasized that using percentage-based yield metrics without defining chip size is misleading, as yield rates vary depending on chip complexity and dimensions.

In late February, Intel officially introduced Intel 18A on its website, declaring the process "ready." Industry estimates suggest that Intel 18A will enter mass production by mid-2025, debuting with the Core Ultra 300 series "Panther Lake" processors, expected to launch in the second half of this year.

Intel 18A incorporates RibbonFET gate-all-around (GAA) transistor technology for precise current control and introduces the industry's first PowerVia backside power delivery, enhancing density and cell utilization by 5–10% while reducing power resistance drop. This results in up to a 4% improvement in ISO power efficiency and significantly lower inherent resistance (IR) compared to front-side power designs.

Compared to Intel 3, Intel 18A delivers a 15% performance-per-watt increase and a 30% improvement in chip density. Intel positions it as the first sub-2nm advanced node available for North American manufacturing, offering a resilient supply alternative.

According to research firm TechInsights, Intel 18A achieves a performance score of 2.53, surpassing TSMC's N2 at 2.27 and Samsung's SF2 at 2.19, making it the highest-performing 2nm-class process technology in the industry.