Intel Reportedly Seeks Orders from NVIDIA and Broadcom

Analysts at UBS suggest that Intel may be pivoting its strategy to focus more on chip design while expanding its foundry business by securing key clients such as NVIDIA and Broadcom.

In a recent report, UBS analyst Timothy Arcuri stated that under the leadership of CEO Pat Gelsinger, Intel's revitalization efforts may prioritize enhancing both design capabilities and advanced manufacturing processes. The company is actively seeking commitments from major clients like NVIDIA and Broadcom for its foundry services, particularly its cutting-edge 18A process technology.

To attract potential clients, Intel is also developing a new, lower-tier version of its advanced process technology, known as 18AP, which could be more appealing for specific applications. According to Intel, NVIDIA appears to be closer than Broadcom to adopting its chip technology, particularly for gaming applications, though power consumption remains a key concern.

Intel is intensifying its competition with TSMC by improving its packaging technology. The company aims to enhance its Embedded Multi-die Interconnect Bridge (EMIB) technology to rival TSMC's CoWoS-L, increasing its attractiveness to the market.

Additionally, Intel's collaboration with UMC is reportedly progressing well, with production expected to begin in the second half of 2026. The partnership is set to manufacture high-voltage FinFET chips, positioning itself as a viable alternative to TSMC's offerings, potentially even being integrated into future Apple products.

Despite Intel's aggressive push, competing with TSMC remains a formidable challenge. Research firm IDC forecasts that the “Wafer Foundry 2.0” market, including advanced packaging services, will grow by 11% annually, reaching a market share of 37% for TSMC by 2025, solidifying its leadership in the industry.