According to a recent research report by UBS analyst Timothy Arcuri, Intel may be reconsidering its strategy by refocusing on chip design while strengthening its foundry business to secure orders from top clients like NVIDIA and Broadcom.
Earlier reports from Reuters, citing sources familiar with the matter, revealed that NVIDIA and Broadcom have already begun manufacturing tests using Intel's latest Intel 18A process technology. This suggests initial confidence in Intel's advanced manufacturing capabilities despite its recent challenges.
Arcuri's report further highlights that Intel's new CEO, Lip-Bu Tan, is expected to emphasize both the company's design expertise and foundry capabilities. Intel is actively working to secure commitments from major clients while enhancing the Intel 18A process.
To attract potential clients, Intel is also developing a low-power variant of the Intel 18A process, known as “18AP.” According to Arcuri, NVIDIA appears more likely than Broadcom to adopt Intel's foundry services, potentially integrating them into gaming GPU-related products. However, power consumption remains a critical concern.
Additionally, Intel may improve its advanced packaging technologies to better compete with TSMC. The company's EMIB (Embedded Multi-die Interconnect Bridge) packaging is positioned as a strong alternative to TSMC's CoWoS-L technology, making it a compelling option for high-performance computing applications.