TSMC 2nm Yields Near 3/5nm, Poised as Best-Selling Node

TSMC is preparing to begin mass production of its next-generation 2nm chips in the second half of 2025, with global tech leaders anticipating significant performance improvements. According to reports from Wccftech, this leap in processing technology is expected to spark strong market demand, potentially exceeding that of the current 3nm generation.

Wccftech notes that TSMC's 2nm process is on track to become the most in-demand node across all process generations. As mass production ramps up by year-end, output is projected to grow rapidly. TSMC has consistently seen robust demand with each new process node, and the upcoming 2nm transition appears poised to break previous records—much like the 3nm node, which saw widespread adoption among leading semiconductor companies.

One of the key drivers of this strong momentum is the maturity of TSMC's 2nm yield, which is now comparable to its 3nm and 5nm nodes. The new platform features a shift to GAAFET (Gate-All-Around Field-Effect Transistor) nanosheet technology, delivering optimized performance and power efficiency—offering a significant edge for advanced IC design. Compared to the N3E process, the 2nm node offers a 10% to 15% improvement in computing performance.

Historically, Apple has been an early adopter of TSMC's most advanced nodes, and the 2nm chips are expected to power the future iPhone 18 series. Other key players embracing the 2nm platform include AI leader NVIDIA, which is rumored to use it in its upcoming Vera Rubin chips, and AMD, which has confirmed the use of 2nm for its next-generation Zen 6 “Venice” CPUs—positioning it for leadership in high-performance computing.

With demand from major tech giants already surging, TSMC is not expected to face any difficulty in securing customers for its 2nm capacity. In fact, demand may even outpace initial supply.

TSMC aims to achieve a monthly production capacity of 50,000 wafers by the end of 2025 and is actively expanding its manufacturing footprint in Taiwan to meet growing demand. By 2027, 2nm capacity is expected to double, and by 2028, TSMC's Arizona facility in the United States will also begin producing 2nm chips—gradually scaling to meet global market needs.