Intel-Microsoft Deal on 18A Process, Google May Follow

At last month's 2025 Intel Foundry Direct Connect event, Intel revealed significant milestones in its next-generation process nodes and advanced packaging technologies. Notably, the Intel 18A process has entered the risk production phase and is on track for full-scale manufacturing later this year. This marks a major step in Intel's roadmap toward leadership in logic scaling and packaging innovation.

Intel also introduced an evolved variant, Intel 18A-P, which is fully compatible with Intel 18A design rules but delivers enhanced performance for a broader range of applications. Early test wafers of Intel 18A-P are already in production. Additionally, Intel 18A-PT, an enhanced version of 18A-P, will support integration with upper-tier chips through Foveros Direct, Intel's cutting-edge 3D advanced packaging technology.

According to a report by TrendForce, Intel has secured a major semiconductor manufacturing agreement with Microsoft, leveraging the Intel 18A process. Talks are reportedly underway with Google as well, which may follow Microsoft’s lead. Prior to this, NVIDIA also initiated discussions with Intel regarding similar collaborations, underscoring growing industry interest in Intel's advanced process capabilities.

Industry analysts highlight that the Microsoft agreement represents a major milestone under CEO Lip-Bu Tan's leadership, significantly boosting Intel's competitiveness in the advanced manufacturing space. With the U.S. rolling out new tariff policies, Intel's extensive network of domestic fabs could offer strategic advantages in reducing trade risks and serving localized production needs.

Looking ahead, Intel plans to launch Intel 18A-P in 2026 and Intel 18A-PT in 2028. The company is also actively collaborating with key partners on its Intel 14A process, having released early versions of the Intel 14A PDK (Process Design Kit). Unlike Intel 18A, which uses PowerVia backside power delivery, Intel 14A will introduce PowerDirect, a next-generation power delivery technology using direct contacts.