MediaTek to Tape Out First 2nm Chip in September

MediaTek CEO Rick Tsai recently announced that the company's first 2nm chip is scheduled to complete tape-out by September this year. Compared to its 3nm predecessor, the new chip is expected to deliver a 15% performance improvement and reduce power consumption by 25%. Tsai also confirmed that future products will adopt advanced A16 and A14 process nodes.

Reflecting on the company's growth, Rick Tsai highlighted MediaTek's successful entry into the 5G market during the pandemic, particularly within the flagship smartphone segment. From 2022 to 2025, the company anticipates a 350% increase in its flagship SoC business, positioning MediaTek to achieve the top global market share in this category. Rick Tsai expressed optimism for the upcoming 6G era, noting that MediaTek is well-positioned to lead with its AI-driven innovations.

MediaTek's chip solutions have already seen widespread adoption across multiple sectors, including smartphones, smart TVs, smart speakers, and Chromebooks. Over the past decade, MediaTek has shipped more than 20 billion chips, equating to approximately 2.5 devices per person worldwide powered by its technology.

In terms of technical advancements, Rick Tsai emphasized the strategic importance of interconnect IP, especially die-to-die connectivity. MediaTek's in-house MLink IP supports the industry-standard UCle interface, offering both standardized and proprietary high-speed options. The company's 224G SerDes technology is already mature, with plans to advance to 448G SerDes to support next-generation data transmission standards, including PAM4 and chip-to-chip (C2C) interconnects.

Rick Tsai also addressed the growing relevance of power management solutions in AI server infrastructure. As power demands rise, the integration of PMICs into chips will become increasingly vital.