Deca and IBM to Build Advanced Packaging Base

On May 22, Deca Technologies announced a strategic agreement with IBM to bring its cutting-edge M-Series and Adaptive Patterning technologies to IBM's advanced packaging facility in Bromont, Quebec, Canada. Under the agreement, IBM will establish a high-volume production line dedicated to Deca's M-Series Fan-out Interposer Technology (MFIT), aiming to accelerate the development and integration of high-performance chiplet and advanced computing systems.

This collaboration is part of IBM's broader strategy to expand its advanced packaging capabilities. The Bromont facility is recognized as one of North America's largest semiconductor packaging and testing centers and has been a leader in packaging innovation for over five decades. Recent investments have positioned the site as a central hub for high-performance packaging and chiplet integration, supporting technologies critical to AI, high-performance computing (HPC), and data center applications.

Deca's M-Series platform is one of the world's most prolific fan-out packaging technologies, with over 7 billion M-Series devices shipped globally. Building on this robust foundation, MFIT integrates embedded bridge chips to enable high-density, low-latency interconnections between processors and memory. As a full-silicon interposer solution, MFIT delivers a cost-effective alternative while offering superior signal integrity, design flexibility, and scalability to meet the growing demands of next-generation electronic systems.

Scott Sikorski, Head of Chiplet and Advanced Packaging Business Development at IBM, emphasized the importance of advanced packaging and chiplet technologies in delivering faster and more efficient computing solutions in the AI era. He noted that the integration of Deca's technologies will keep IBM Bromont at the forefront of innovation, helping accelerate time-to-market and boost performance for AI and data-intensive applications.

Tim Olson, Founder and CEO of Deca Technologies, highlighted IBM's deep legacy in semiconductor innovation and advanced packaging, calling the company an ideal partner for scaling MFIT technology. "We're excited to work together to bring this advanced interposer technology to the North American ecosystem," Olson said.