NVIDIA GB200 AI Server Issues Resolved, Production Accelerates

According to recent international media reports, several of NVIDIA's key partners—such as Foxconn, Inventec, Dell, and Wistron—have successfully overcome a series of technical challenges and have begun shipping Blackwell AI servers, including the highly anticipated GB200 systems.

The original delivery schedule for the GB200 was delayed due to a set of technical issues discovered late last year. An engineer involved in the project revealed that internal testing uncovered interconnect problems, prompting a collaborative effort between NVIDIA and its ecosystem partners to resolve the issues over the past two to three months.

In addition to the interconnect challenges, engineers also faced several other hardware-level difficulties. These included overheating concerns and leaks in the liquid cooling system. Other engineers reported further complications caused by the sheer number of processors, which led to software errors and synchronization difficulties between chips—making chip-to-chip connectivity particularly complex.

Industry analysts noted that NVIDIA may not have allocated sufficient preparation time ahead of the GB200 rollout. However, starting in the second half of this year, inventory pressure is expected to ease. During COMPUTEX 2025, NVIDIA confirmed that shipments of GB200 server cabinets began at the end of Q1, and manufacturing capacity is now ramping up rapidly to meet growing demand.

Looking ahead to the third quarter, NVIDIA is preparing for the launch of the next-generation GB300 series. Reports suggest that certain design compromises have been made—most notably the decision to drop the newer Cordelia board configuration in favor of the more established Bianca design used in the GB200.

Two technology partners have reported installation issues resulting from this change, as the revised system architecture does not support individual GPU replacement. This development aligns with earlier reports from May, which indicated that NVIDIA originally intended to adopt SOCAMM memory technology for the Blackwell Ultra GB300, but this integration was delayed—primarily due to the transition back to the Bianca design from Cordelia.