Apple A20 May Debut Wafer-Level Multi-Chip Packaging

Apple is reportedly preparing a major overhaul of its chip design architecture for the 2026 iPhone lineup. For the first time, the company is expected to adopt advanced wafer-level multi-chip packaging (WMCP) technology in its A-series processors.

According to a recent report by Jeff Pu, an analyst at GF Securities, the upcoming iPhone 18 Pro, iPhone 18 Pro Max, and the long-rumored iPhone 18 Fold are all projected to be powered by the Apple A20 chip, which will be manufactured using TSMC's second-generation 2nm process node.

A key highlight of the A20 chip is its use of Wafer-Level Multi-Chip Module (WMCM) packaging. This advanced method enables the integration of different components—such as SoC and DRAM—at the wafer stage, before being diced into individual chips. Unlike traditional approaches, WMCM does not require an interposer or substrate, which enhances thermal performance and signal integrity while reducing overall complexity.

TSMC is expected to support this transition by establishing a dedicated WMCM production line at its advanced AP7 facility in Chiayi, Taiwan. The line will utilize equipment and processes similar to CoWoS-L, but with key modifications to eliminate the need for substrates. TSMC aims to scale up WMCM production to 50,000 wafers per month by the end of 2026, with further expansion to 110,000–120,000 wafers per month by late 2027, driven by growing adoption.

For Apple, this marks a significant leap in chip innovation—comparable to its early adoption of 3nm technology. It also signals a broader industry trend: high-performance packaging technologies, once exclusive to data center GPUs and AI accelerators, are now making their way into consumer smartphones.