TSMC Hits 60% Yield as Samsung Trails at 40% in 2nm Race

According to reports, TSMC and Samsung are set to ramp up production of next-generation 2nm chips in the second half of 2025, marking a pivotal moment in the advanced semiconductor race. However, yield performance has emerged as a key differentiator, with TSMC reportedly pulling ahead.

According to South Korean industry sources, TSMC has already started receiving orders for its 2nm process nodes. Production is expected to begin later this year at its Baoshan and Kaohsiung facilities in Taiwan. These 2nm chips will be TSMC's first to adopt the gate-all-around (GAA) transistor architecture, which offers a 10–15% performance boost, up to 30% power efficiency improvements, and a 15% increase in transistor density compared to the current 3nm process.

Initial clients for TSMC's 2nm platform are expected to be extensions of its 3nm partnerships, with major players like Apple, NVIDIA, AMD, Qualcomm, and MediaTek anticipated to lead adoption. At the 2025 Computex event, MediaTek CEO Rick Tsai confirmed that the company plans to finalize the design of its 2nm chips by September, hinting at a new flagship product launch.

Samsung also aims to commence 2nm production in the same timeframe, reportedly for its upcoming Galaxy S26 series powered by the in-house Exynos 2600 chipset. However, while Samsung pioneered GAA technology in 3nm manufacturing, its early production faced low yield challenges—a hurdle that appears to persist.

Recent reports suggest TSMC's 2nm yield has already surpassed 60%, reaching a stable mass production threshold. In contrast, Samsung's 2nm yield is estimated at around 40%, posing a significant challenge in securing major technology projects. To enhance its competitiveness, Samsung has recruited former TSMC executive Margaret Han to lead its foundry operations, leveraging her expertise to improve yield and execution.

As both companies push toward 2nm mass production, the competition for next-generation chip design projects is expected to intensify, with performance, efficiency, and manufacturing reliability taking center stage.