Google Shifts Tensor G5 Chip Production to TSMC

According to recent reports, Google will adopt TSMC's advanced foundry services for the upcoming Pixel 10 series, marking a significant departure from its previous reliance on Samsung for Tensor chip production. The next-generation Tensor G5 chip, powering Pixel 10 through Pixel 14, will be exclusively manufactured by TSMC under a five-year agreement. This chip will leverage TSMC's second-generation 3nm process node (N3E) and utilize InFO-POP packaging technology.

This strategic shift has sparked concern within Samsung, particularly in its Device Solutions division. In response, Samsung has held a global strategy meeting to address ways to enhance its wafer foundry capabilities. A key priority is to improve the yield rate of its own 3nm process to over 50%, a critical threshold for regaining customer confidence and maintaining competitiveness.

Google's transition to in-house Tensor chips began in collaboration with Samsung, building on the Exynos platform. However, persistent yield and stability issues at the 3nm node prompted Google to shift manufacturing to TSMC, known for its superior process maturity and reliability. Industry insiders note that Samsung's foundry unit continues to face technical hurdles, adding to internal concerns.

Although Google still relies on Samsung for certain components—such as the Exynos 5G modem used in the Pixel 10—the primary chip production for the Pixel lineup has effectively moved to TSMC. Samsung aims to reclaim its competitive edge by strengthening its process technology and re-establishing trust among major customers.