Report: Intel Cancels In-House Glass Substrate Project

Intel is reportedly making major strategic shifts in its semiconductor foundry business, including halting the development of its in-house glass substrate technology. These changes come as part of a broader internal restructuring under the leadership of new CEO Lip-Bu Tan, who is driving a revised roadmap and operational overhaul.

According to a recent report by ComputerBase, Intel plans to streamline its focus by reducing its investment in certain future projects and optimizing resource allocation. One of the most notable decisions involves scaling back its semiconductor packaging ambitions, specifically by discontinuing internal development of glass substrates — a field in which Intel has long held a technological edge.

Instead, the company will rely on external partners for sourcing glass substrates, signaling a shift away from non-core initiatives in favor of consolidating its strengths in core areas such as central processing units (CPUs) and advanced node manufacturing.

Intel's advanced Intel 18A (1.8nm) process node has also experienced delays and underwhelming traction among external partners. In response, Intel will prioritize this node for internal use only, particularly in upcoming products like Panther Lake and Clearwater Forest, effectively discontinuing its availability for external adoption. While this doesn't signify an end to Intel's pursuit of cutting-edge nodes, it reflects a deliberate move to reduce foundry operational costs and improve efficiency.

Looking ahead, Intel remains optimistic about its Intel 14A (1.4nm) process, which it believes could compete with leading foundry technologies globally. However, to fully commercialize Intel 14A for external use, the company acknowledges the need for significant external capacity and ecosystem support.