UMC Wins Qualcomm Packaging Deal, Advances Foundry Tech
According to Taiwanese media reports, leading foundry United Microelectronics Corporation (UMC) is accelerating its push into high-voltage process platforms and advanced semiconductor packaging. Sources suggest UMC is extending its existing 12nm process collaboration with Intel to include 6nm technology, marking a significant move toward advanced node manufacturing.
UMC is investing NT$15.6 billion (approx. US$480 million) in 2024 to enhance its R&D capabilities. The focus areas include 5G communications, artificial intelligence (AI), the Internet of Things (IoT), and automotive electronics. UMC is also making strides in specialty process technologies, including 12nm and 14nm nodes and 3D IC advanced packaging solutions.
One of UMC's current highlights is its development of embedded high-voltage FinFET technologies. The company has made notable progress in its 14nm embedded High Voltage (14eHV) platform and continues to expand its 12nm FinFET platform (12FFC). Compared to its 14nm counterpart (14FFC), the 12nm process achieves up to 10% performance gains and reduces power consumption by 20% through voltage scaling. The platform also cuts chip area by over 10% using a six-track cell architecture and saves on three photomask layers—further strengthening UMC's cost competitiveness.
Market sources claim UMC is in talks to extend its Intel partnership from 12nm down to 6nm, signaling a bold step away from the saturated mature node market toward cutting-edge process nodes.
In the field of advanced packaging, UMC is also reportedly nearing volume production for Qualcomm's high-end packaging solutions. The company's in-house developed interposer has successfully passed Qualcomm's validation, with pilot production already underway. Mass production is expected as early as Q1 2026.
UMC and Qualcomm initiated their collaboration in late 2024, targeting AI PCs, automotive systems, and AI servers. Qualcomm has reportedly installed furnace tube equipment at UMC's fab, underscoring the strategic depth and trust in the partnership. The validated product uses capacitors with a high density of 1500nF/mm² to meet the requirements of Qualcomm's ICs and memory components.
Industry insiders note that UMC's past contribution to advanced packaging was limited to interposers in RFSOI processes, which had minimal revenue impact. However, the expansion into full-package solutions for high-performance computing (HPC) marks a strategic breakthrough that could help UMC differentiate itself from low-margin competition in mature nodes.
Advanced packaging techniques like 2.5D and 3D stacking require interposer capacitors and through-silicon vias (TSVs) to connect signals between multiple stacked or side-by-side chips. UMC is equipped with both interposer manufacturing tools and TSV experience, having implemented TSVs over a decade ago for AMD GPU chips—making the company well-positioned for next-gen packaging demands.
Although UMC declined to comment on specific customers, it emphasized that advanced packaging remains a key growth focus. The company plans to build a comprehensive ecosystem by partnering with subsidiaries like Faraday Technology and Andes Technology, along with memory partners such as Winbond.
