Chopping wave! Eight-inch wafer fab capacity utilization declined significantly in the second half of the year

According to TrendForce's survey, wafer foundries have seen a wave of order cuts, and the first wave of order revisions came from large-size Driver IC and TDDI. The mainstream processes of the two are 0.1Xμm and 55nm, respectively.

Recently, PMIC, CIS, and some MCU and SoC orders have been cut off. Although they are still mainly used for consumer applications, wafer foundries have been unable to bear large orders from customers, and the capacity utilization rate has officially declined.

Looking at the trend in the second half of the year, TrendForce said that apart from the continuous downward revision of driver IC demand, there has been no improvement in peripheral components such as smartphones, PCs, TV-related SoCs, CIS and PMICs. It is planned that the phenomenon of order cutting occurs simultaneously in 8-inch and 12-inch factories, and the process includes 0.1Xμm, 90/55nm, 40/28nm, and even the advanced process of 7/6nm is not immune.

According to TrendForce research, the capacity utilization rate of the 8-inch wafer process node (including 0.35-0.11μm) may decline the most. The process products are mainly Driver IC, CIS and Power-related chips (PMIC, Power discrete, etc.). Driver IC is affected by The demand for TVs, PCs, etc. has been directly impacted by the freezing, and the downward revision of film production has been the most severe. At the same time, the supply of PMICs, which were still tight in the first half of this year, gradually became more balanced after the redistribution of production capacity.