
Recently, TSMC unveiled significant progress on its 5nm semiconductor wafer fab, named "FAB21," located in Phoenix, Arizona, through a post on the professional networking platform LinkedIn. This state-of-the-art facility, with an estimated value of $12 billion, is set to become the inaugural large-scale 5nm chip production plant in the United States.
In the LinkedIn update, TSMC stated, "TSMC Arizona is steadfast in its commitment to delivering the most advanced semiconductor technology to the United States, adhering to our established timeline and plans."
The announcement spotlighted a noteworthy milestone in the construction domain – the "topping-out" ceremony, where TSMC and its local collaborators celebrated the completion of the final beam placement for the office building of the FAB21 wafer fab. This event, attended by over 4,000 participants, including representatives from TSMC and its partners, marked a significant achievement.
TSMC had previously communicated its strategy to initiate the equipment move-in process at the Arizona wafer fab in the latter half of 2022. The wafer fab is anticipated to commence its initial production phase in the first quarter of 2024, boasting a monthly production capacity of 20,000 wafers.
During the question-and-answer session of TSMC's financial earnings conference call in mid-July, Chairman Liu Deyin addressed the subject of higher-than-anticipated costs associated with the new Arizona wafer fab. TSMC emphasized its unwavering commitment to introducing cutting-edge semiconductor technology to the United States according to the established schedule.