TSMC 1.4nm Fab May Start by Year-End, Mass Production 2028

According to media reports on July 19, TSMC is set to begin construction of its first 1.4nm semiconductor fabrication plant at the Central Taiwan Science Park (CTSP) by the end of this year. The facility is expected to achieve risk trial production by late 2027, with full-scale mass production scheduled for the second half of 2028.

TSMC previously disclosed its site expansion plans in April, officially designating the CTSP Phase II development as Fab 25. Industry sources indicate that the project includes building four advanced 1.4nm fabs, with the initial site transitioning from an earlier 2nm roadmap to a sub-2nm process node. The first phase aims for a monthly capacity of approximately 50,000 wafers.

The CTSP Phase II expansion also reserves around five hectares for ecosystem partners in areas such as semiconductor equipment, IC design, optoelectronics, and precision machinery. Several companies have already applied to establish a presence near TSMC's facilities to foster close technological collaboration.

There is also industry speculation that NVIDIA may establish a research center, supercomputing facility, or procurement hub within the park. Park authorities stated that once public infrastructure is completed, vendor application reviews will commence, with final approvals expected by next year.

Regarding TSMC's strategic roadmap, supply chain sources suggest that the initial two fabs under Phase I will focus on the 1.4nm process for 2028 mass production. Phase II could potentially advance further, moving toward the cutting-edge A10 (1nm) technology node.