TSMC Speeds Up 2nm Expansion, Eyes 1.5x Growth

According to reports, TSMC is set to commence volume production of its cutting-edge 2nm process in the second half of 2025, staying on track with its manufacturing roadmap. Industry sources report overwhelming demand from key clients such as Apple, AMD, and Intel, with Qualcomm, MediaTek, and Nvidia expected to adopt the technology soon after. To address this surge, TSMC is planning a significant capacity expansion — targeting an increase from 40,000 wafers per month by year-end to 100,000 wafers monthly in 2026, representing a 1.5x growth. By 2027, capacity could potentially double again to 200,000 wafers per month.

Market analysts predict that by 2027, 2nm could surpass 7nm, 5nm, and even 3nm nodes in production scale, becoming TSMC's largest advanced process node and a major revenue driver. Currently, TSMC's monthly production capacity stands at approximately 160,000 wafers for 7nm and 5nm, and about 130,000 to 160,000 wafers for 3nm.

TSMC is reportedly concentrating much of this 2nm expansion at its Kaohsiung F22 facility, with potential plans for up to eight dedicated 2nm fabs if customer demand continues to escalate. The company's advanced nodes not only boost output volume but also command higher pricing, enhancing profitability through both scale and premium value.

TSMC previously stated that its 2nm process, along with its A16 technology, leads the industry in energy-efficient computing — an area of relentless demand. The company anticipates that product design wins for 2nm in the first two years will outpace those of its 3nm and 5nm predecessors, particularly driven by smartphone and high-performance computing (HPC) applications.

Though TSMC declined to comment on market speculation, the list of anticipated adopters includes top innovators like Apple, AMD, Intel, Qualcomm, MediaTek, and Nvidia, reflecting strong ecosystem support for the forthcoming 2nm node.