iPhone 18 to Feature TSMC 2nm Chips with WMCM Packaging

According to reports, Apple's upcoming iPhone 18 could mark a milestone in semiconductor technology. Reports suggest its A20 and A20 Pro chips may be the first Apple chipsets built on TSMC's cutting-edge 2nm process, paired with a new wafer-level multi-chip module (WMCM) technology aimed at improving performance while controlling costs.

The 2nm process comes with a hefty price tag, with each advanced chip potentially costing up to $30,000, placing Apple among a select group of companies embracing this next-generation node. To optimize costs, Apple is exploring innovative packaging solutions that could replace traditional InFO (integrated fan-out) techniques.

Analyst Ming-Chi Kuo notes that as Apple pushes for higher efficiency and A20 chip performance, WMCM may gradually replace conventional methods. While TSMC's 2nm trial yields hover around 60%, output variability remains a factor, and Apple's focus on WMCM is seen as a strategic move to maximize yield and manage expenses.

It is still unclear whether WMCM packaging will be limited to premium models like the iPhone 18 Pro and the foldable iPhone 18, or if it will extend to standard iPhone 18 and iPhone 18 Air models.

WMCM allows Apple to integrate RAM, CPU, GPU, and the Neural Engine directly on the same wafer. Compared to traditional silicon interposer methods, this integration enhances instruction cycles and AI performance, reduces power consumption, extends battery life, and frees up space within the device.

The new packaging will use molded underfill (MUF) technology, combining underfill and molding processes to reduce material usage, improve chip yield, and boost production efficiency.