According to TSMC director Chin-Ching Liu, the company's plan to break ground on its second factory in Kumamoto, Japan, is still on track for 2025, despite some schedule adjustments. He emphasized that Japan remains a high priority for TSMC.
TSMC's first Kumamoto fab, located in Kikuyo Town, Kumamoto Prefecture, already entered mass production at the end of 2024, focusing on 12–28nm logic chips. The upcoming Kumamoto-2 fab is designed to handle Japan's most advanced 6nm processes, significantly expanding local production capacity.
Together, the two Kumamoto fabs are expected to deliver a combined monthly output of over 100,000 wafers. Total investment in these facilities is estimated at around ¥2.96 trillion, with the Japanese government providing up to ¥1.2 trillion in subsidies.
While construction of the Kumamoto-2 fab was initially planned for early 2025, it faced delays due to logistical challenges such as traffic congestion. Liu confirmed that groundbreaking is now scheduled for the end of 2025, which may push mass production to around 2028—about a year later than first projected.
He also noted that TSMC's board meeting in Kumamoto, planned for early 2026, will outline more detailed production plans for the new facility.