SK Hynix Strengthens Lead in Advanced Memory Tech

According to reports from Business Post and ZDNet Korea citing JPMorgan, SK Hynix continues to dominate the high-bandwidth memory (HBM) market, with its market share expected to stay above 50% at least through 2027. In 2025, SK Hynix is projected to hold 56% of the market, followed by Samsung Electronics at 26% and Micron at 18%. While Samsung's share may dip in 2024, SK Hynix's strong technology roadmap keeps it in the lead.

Beyond HBM, SK Hynix is expanding its footprint in other memory technologies. Its latest half-year report highlights the development of LPDDR5X based on the 1c DRAM process, designed for high efficiency and advanced heat dissipation. Market demand is expected to rise as devices push for greater performance. The company also introduced a new mobile DRAM using "High-K EMC" materials, offering 3.5× better thermal conductivity and 47% lower thermal resistance—an edge for AI-driven smartphones that demand higher power and generate more heat.

In NAND, SK Hynix marked a milestone by starting mass production of 321-layer QLC NAND, making it the first in the industry to break the 300-layer barrier. Analysts note this positions the company for rapid growth in both revenue and share within the NAND segment.

Looking ahead, Morgan Stanley projects NVIDIA will account for over 70% of global HBM demand in 2025, and SK Hynix remains its key partner. While Samsung and Micron are racing to advance sixth-generation HBM, SK Hynix's close collaboration with NVIDIA ensures it maintains a crucial competitive advantage.