TSMC 3nm N3P Wafer Prices Rise 20%

According to industry reports, Apple's latest iPhone 17 series has officially launched, featuring the A19 chip built on TSMC's newest 3nm N3P process. The upcoming A20 chip will move into the 2nm era. Meanwhile, in the Android camp, MediaTek and Qualcomm's 3nm chips are reaching the end of their production cycle. Sources indicate that the last batch of 3nm chips has seen wafer costs rise roughly 20%, with 2nm production next year expected to push prices over 50% higher.

The supply chain suggests that MediaTek and Qualcomm are set to release their new flagship chips, the Dimensity 9500 and Snapdragon 8 Elite Gen 5, this week. Both reportedly use TSMC's N3P process, similar to Apple's A19, with improvements in performance and power efficiency. However, wafer prices have increased significantly compared to previous generations, with reported rises of 16–24%.

Looking ahead, the smartphone chip industry is entering the 2nm era. Sources reveal that TSMC's advanced process nodes require substantial capital investment, though yields have already stabilized. As a result, there are currently no discounts or price negotiations planned, with the minimum price increase over 3nm estimated at 50%.

IC design companies previously noted that to address tariffs, exchange rates, and supply chain efficiency, TSMC informed customers that wafer prices for 5nm, 4nm, 3nm, and 2nm processes could rise by about 5–10% in 2026. This signals that clients relying on TSMC's advanced nodes will face higher production costs for their upcoming chips.