GlobalFoundries and Zensemi Team Up on 40nm Auto Chips

On September 25, GlobalFoundries (GF) announced a strategic partnership with Guangzhou Zensemi Technology, marking a new chapter in its localization strategy for the Chinese semiconductor market. The collaboration will begin with mature 40nm technology, focusing on CMOS solutions for automotive electronics, with GF providing key technical support.

Victor Hu, President of GlobalFoundries China, made his first public appearance since taking office on September 1. With more than 25 years of experience at Qorvo, HTC, and Broadcom, Hu emphasized that this partnership is designed to strengthen GF's local presence and meet the fast-growing demand in China's semiconductor sector.

Sudipto Bose, VP of Automotive at GF, highlighted that China is now one of the fastest-growing markets for automotive electronics, already accounting for 18% of the company's shipments.

This move follows GF's earlier financial disclosure in August, when it confirmed reaching a final agreement with a Chinese foundry partner to secure reliable supply for mainland customers—now officially revealed to be Zensemi.

Founded in April 2021 with a registered capital of RMB 7.275 billion, Zensemi is building a 12-inch wafer fab in Guangzhou focused on sensors and custom ASICs. Its first phase, which began construction in late 2022, is expected to reach a capacity of 20,000 wafers per month by the end of 2025, leveraging MEMS sensor and 130-55nm process technologies.

Looking ahead, GF aims to strengthen cooperation with local OEMs, fabless design houses, and multinational clients, steadily expanding its manufacturing and delivery capabilities within China's dynamic semiconductor ecosystem.