Samsung HBM4 Chips Near NVIDIA Certification

Samsung Electronics is approaching the final stage of its HBM4 memory chip certification testing with NVIDIA, with results expected in December. This milestone could mark one of the most significant comebacks for Samsung in the high-end memory market in recent years. At the same time, Samsung has reportedly reorganized its memory R&D division to ensure more stable HBM production.

Industry sources indicate that Samsung's HBM4 evaluation is in its final phase and could conclude as early as December 2025. Preliminary tests show strong performance in speed, power efficiency, and reliability. Samsung's HBM4 prototypes have already exceeded the 11Gbps transfer rate required for NVIDIA's next-generation GPUs.

This marks a turnaround from the HBM3E cycle, when yield and stability issues caused Samsung to lag behind competitors. For HBM4, Samsung combined enhanced 1c-class DRAM with 4nm logic substrates, a configuration crucial for managing heat and power consumption at transfer rates above 11Gbps.

Analysts expect the December results to potentially reshape the HBM market. Successful certification would accelerate Samsung's sample shipments and expand its customer base, moving the market toward a more balanced two-supplier structure.

If NVIDIA approves Samsung's HBM4, experts say it would be the company's strongest rebound in years, with the potential to reshape memory market dynamics starting in 2025. Major cloud providers such as Microsoft, Meta, and Google are locking in HBM supply for 2025 and 2026, shifting procurement from short-term cycles to long-term contracts focused on mature, reliable manufacturing.

NVIDIA is also aiming to reduce dependency on a single memory supplier. Samsung's HBM4 performance strengthens NVIDIA's supplier diversification strategy.

HBM4 demands advanced engineering, including precise TSV alignment, mature DRAM processes, and strict thermal and power management at speeds above 11Gbps. While Samsung is considered to have stable R&D results in these areas, early production yield remains the main uncertainty. Analysts caution that disappointing test results could allow competitors to further solidify their lead. HBM4 is widely regarded as one of the "most critical battlegrounds" in the industry, with next year's market structure heavily influenced by NVIDIA's decision.

Samsung has integrated its memory R&D division under the design department, reversing a 2024 decision to separate the HBM team in response to yield issues. The reorganization is led by Samsung VP Hwang Sang-joon, head of DRAM products and technology.

Recent reports indicate that Samsung's 1c-class DRAM yield for HBM4 has reached around 70%, reinforcing confidence in the stability of its HBM R&D and manufacturing. Samsung plans to advance its HBM4, HBM4E, and future HBM5 roadmap by combining more advanced DRAM processes with next-generation chip technologies. Analysts note that NVIDIA's final certification will play a decisive role in Samsung's competitiveness from 2025 onward and could determine whether the HBM market evolves into a stable two-supplier structure.