Samsung to Win Over Half of NVIDIA SOCAMM 2 Orders

According to Korean outlet Hankyung, Samsung Electronics has secured more than 50% of NVIDIA's orders for next year's second-generation SOCAMM (System on CAMM) memory, a major win that reshapes NVIDIA's high-performance memory roadmap.

The report says NVIDIA's annual demand for SOCAMM memory is around 20 billion gigabits. Samsung is in talks to take on about half of that volume—roughly the equivalent of 24Gb LPDDR DRAM shipped at a massive scale—requiring an estimated 30,000 to 40,000 wafers per month, or about 5% of Samsung's total DRAM capacity. SK hynix is expected to cover most of the remaining demand, while Micron has reportedly won only a small portion of the orders.

Samsung's early lead is widely linked to the strong yield and performance of its sixth-generation “1c” 10-nm-class DRAM. That technical edge appears to have tilted SOCAMM 2 evaluations in Samsung's favor and shifted a supply landscape that had previously leaned toward Micron.

SOCAMM is NVIDIA's newer high-performance memory module built on a Compression Attached Memory Module (CAMM) design. It packs multiple low-power DRAM chips onto a thinner substrate, delivering better space efficiency and power savings than traditional DDR5 RDIMMs.

Unlike HBM, which is tailored for GPUs, SOCAMM is designed primarily for CPUs and is expected to play a key role in large-scale AI inference and data movement. It uses high-speed copper interconnects for solid signal integrity and thermal behavior, and its module form factor allows easier upgrades and maintenance inside servers.

As AI servers push for higher density and lower power consumption, SOCAMM is being viewed as the next architectural step after HBM. Its modular design marks a shift away from permanently soldered memory toward systems that are easier to service and scale.

Samsung, SK hynix, and Micron all showed SOCAMM prototypes at NVIDIA's GTC 2025 event, but rollout was delayed as performance and stability were refined. NVIDIA later moved ahead with co-development of SOCAMM 2, which is expected to pair with the company's Vera CPU next year. SOCAMM 2 lifts data rates to 9,600 MT/s, up from 8,533 MT/s in the first generation.