
China Taiwan-based chipmaker United Microelectronics Corp (UMC) has signed a memorandum of understanding with U.S. company Polar Semiconductor to explore joint production of 8-inch wafers in the United States.
Under the agreement, the two companies will evaluate which products can be manufactured at Polar's recently expanded 8-inch fab in Minnesota. The planned output is expected to support a wide range of applications, including automotive electronics, data centers, consumer devices, aerospace, and defense systems.
The partnership aims to combine Polar's U.S. manufacturing base with UMC's 8-inch process technologies and industry experience. Both companies said the collaboration is designed to help customers build more flexible sourcing strategies while reducing dependency on a single region.
They also highlighted the growing importance of strengthening domestic semiconductor production in the U.S., especially as geopolitical risks continue to reshape global supply chains. The project is expected to contribute to greater resilience in 8-inch wafer manufacturing capacity within the country.
“This cooperation is closely aligned with our strategy to respond to increasing demand for U.S.-based manufacturing,” said Ken Obuszewski, Vice President of Marketing at Polar Semiconductor.
Oliver Chang, Senior Vice President of Global Sales at UMC, added that the move reflects customer demand for locally produced chips in the U.S. market.
UMC is Taiwan’s second-largest contract chipmaker after TSMC, with most of its fabs located in Taiwan and additional manufacturing sites in Japan and Singapore.