Samsung vs SK Hynix Race for HBM4 Orders

According to South Korean media, Samsung Electronics and SK Hynix are in a close race to secure orders for NVIDIA's sixth-generation high-bandwidth memory (HBM4). HBM4 is expected to play a key role in NVIDIA's next-generation AI accelerator, Rubin, slated for launch in the second half of 2026.

SK Hynix has already delivered customer samples (CS) to NVIDIA and is conducting quality verification. The company reportedly adjusted certain circuits to address speed and reliability issues found in early testing. Industry observers note that these changes are typical "revision updates" rather than a full redesign. Final test results are expected by early 2026.

Meanwhile, Samsung is accelerating its efforts. Reports indicate that in November, Samsung completed its internal production readiness approval (PRA) for HBM4 and has begun applying for NVIDIA CS certification. Samsung's base die uses a 4nm process, while its core chip incorporates sixth-generation 1c DRAM at a 10nm-class node, with its technical advantages already validated internally.

In addition, both Samsung and SK Hynix have started discussions with NVIDIA regarding HBM4 supply volumes for 2026.