TSMC 3nm Process Prices to Rise 3%–10% in 2026

According to reports from Taiwan's media, booming demand for artificial intelligence is stretching TSMC's 3nm advanced process capacity, with supply continuing to lag behind orders. Market sources say TSMC has already discussed pricing adjustments with customers and plans to raise advanced-node wafer foundry prices for four consecutive years from 2026 through 2029, with the first increase—expected to be a single-digit percentage—taking effect on January 1, 2026.

Industry research firms estimate that advanced process pricing in 2026 could rise by around 3% to 10%, depending on the specific node and customer profile. While the actual increases may vary, most are expected to come in higher than 2025 levels, reflecting rising manufacturing costs and persistent capacity tightness.

Despite the proposed price hikes, customers are reportedly continuing to reserve advanced-node capacity aggressively, highlighting the intensity of the current AI-driven technology race. New platforms from major players such as NVIDIA and AMD, along with expanded AI adoption by ASIC-focused companies like Broadcom, are seen as key drivers keeping demand for sub-3nm processes firmly ahead of supply.

Some analysts further note that 3nm capacity is likely to remain constrained into next year, supporting expectations of an additional price increase of around 3%.

In response to market speculation about pricing, TSMC has previously stated that its pricing strategy is guided by long-term considerations rather than short-term opportunities, and that it continues to work closely with customers to deliver sustained value.