
Recently, MediaTek introduced its next-generation Wi-Fi 8 chip platform, the Filogic 8000 series, marking a major step in building the Wi-Fi 8 ecosystem. The series demonstrates MediaTek's ongoing commitment to advancing wireless communication technology while providing high-reliability connectivity across a wide range of devices. These include broadband gateways, enterprise access points, smartphones, laptops, smart TVs, streaming devices, tablets, IoT gadgets, and AI-powered applications.
With the growing number of connected devices, wireless networks face increasing congestion and interference, often leading to unstable connections and slower response times. Stable Wi-Fi performance is now more critical than ever, and Wi-Fi 8 is specifically designed to meet these demands. In high-load environments—such as AI-driven applications—Wi-Fi 8 delivers robust connectivity, ultra-low latency, higher bandwidth, improved energy efficiency, and optimized link quality for a seamless user experience.
The Filogic 8000 series focuses on four key innovation areas:
· Cooperative Access Points: Features like Coordinated Beamforming (Co-BF), Coordinated Spatial Reuse (Co-SR), and Multi-AP Scheduling (MAP) allow multiple APs to work together, reducing interference and improving overall network throughput.
· Spectrum Efficiency and Coexistence: Technologies such as Dynamic Subband Operation (DSO), Non-Primary Channel Access (NPCA), and In-Device Coexistence (IDC) ensure efficient spectrum allocation, even in dense network environments.
· Coverage and Range: Enhanced Long Range (ELR) and Distributed-Tone Resource Units (dRU) improve uplink performance and reduce latency, boosting AI application performance while maintaining stable connectivity at network edges through seamless roaming.
· Latency and Reliability Optimization: Intelligent rate adaptation and Aggregated PPDU (APPDU) provide consistent, low-latency performance for real-time applications, including XR, online gaming, and industrial automation.
These advancements make Wi-Fi 8 a scalable, resilient, and future-ready platform, ideal for high-density, high-performance wireless networks. As AI and latency-sensitive applications continue to grow, the demand for reliable connectivity is reaching new heights. The Filogic 8000 series empowers gateways and end devices with robust capabilities, continuing MediaTek's leadership since the Wi-Fi 7 era.
MediaTek ships over 2 billion connected devices annually and collaborates with partners including Deutsche Telekom, Airties, SoftAtHome, and Zyxel to deliver stable and reliable wireless experiences for smart devices. The Filogic 8000 series will target high-end and flagship devices, with the first chips expected to ship later this year.