Samsung Exynos 2700 Leaks: SF2P, Arm C2

Samsung's next leap in mobile processing is starting to take shape. While the upcoming Exynos 2600, built on a 2nm process, is widely expected to debut in the Galaxy S26 series, new leaks are already shifting attention to its successor—the Exynos 2700.

According to the latest reports, the Exynos 2700 is scheduled for release around 2027 and carries the internal codename "Ulysses." The chip is expected to be manufactured using Samsung's second-generation 2nm GAA process, known as SF2P. Compared with the earlier SF2 node, SF2P is said to deliver roughly 12% higher performance while cutting power consumption by about 25%, pointing to a meaningful efficiency upgrade for future flagship smartphones.

On the CPU side, Exynos 2700 is rumored to adopt Arm's next-generation C2 series cores. The configuration is expected to include one high-performance C1-Ultra core running at up to 3.90GHz, with some sources suggesting it could reach as high as 4.20GHz, alongside three C1-Pro cores at 3.25GHz and six additional C1-Pro cores clocked at 2.75GHz. Thanks to the architectural improvements in the C2 family, overall IPC performance could see an uplift of around 35%, a significant jump for real-world responsiveness and multitasking.

Graphics capabilities are also set to advance. The chip is expected to integrate Samsung's Xclipse 960 GPU, with support for hardware-accelerated ray tracing, further strengthening its positioning for advanced mobile gaming and graphics-intensive applications. Although clock speeds have not yet been disclosed, the inclusion of ray tracing highlights Samsung's continued focus on console-like visual experiences on mobile devices.

For on-device AI workloads, Exynos 2700 is tipped to feature an upgraded AI engine powered by a 32K MAC neural processing unit. This should translate into faster and more efficient processing for tasks such as image recognition, language models, and real-time AI features directly on the device.

Memory and storage support are also moving forward. Exynos 2700 is expected to support LPDDR6 memory and UFS 5.0 storage, enabling substantially faster data transfer rates. Performance gains in this area are estimated at around 30% to 40%, with LPDDR6 offering bandwidth of up to 14.4Gbps, which will be particularly beneficial for high-resolution imaging, gaming, and AI-driven applications.

Thermal management is another area receiving attention. The new chip is rumored to adopt an upgraded FOWLP-SbS (side-by-side) packaging technology. This design allows both DRAM and the application processor to share a unified thermal pathway via a copper-based heat spreader. Unlike the Exynos 2600, where only part of the AP directly contacts the heat spreader, the Exynos 2700 is expected to feature full coverage, improving heat dissipation under sustained workloads.

In terms of raw performance, early estimates suggest that if the Exynos 2700 uses the higher 4.20GHz C1-Ultra core, it could reach around 4,800 points in Geekbench 6 single-core tests and approximately 15,000 points in multi-core scores. That would represent gains of roughly 40% in single-core and 30% in multi-core performance compared with the Exynos 2600.

Although these details are still based on leaks and projections, they paint a clear picture of Samsung's ambitions for its future flagship mobile processors: higher efficiency, stronger AI capabilities, improved graphics, and more robust thermal design—all key factors for the next generation of high-performance smartphones.