SK Hynix to Invest $12.9B in Chip Packaging

According to multiple reports, SK Hynix announced on January 13 that it plans to invest 19 trillion won (around USD 12.9 billion) in South Korea to build an advanced chip packaging facility, targeting the fast-growing demand for AI-related memory. Construction is scheduled to begin in April this year, with completion expected by the end of 2027.

The new facility will focus on advanced memory packaging, a critical step in the production of high-bandwidth memory (HBM). As AI workloads continue to scale across data centers and accelerated computing platforms, demand for HBM is rising sharply. This investment is expected to strengthen SK Hynix's ability to support next-generation AI systems and further reinforce its position in the AI memory space.

SK Hynix noted that intensifying global competition in AI is driving a rapid increase in demand for specialized AI memory, making it essential to expand HBM capacity and packaging capabilities. Industry data also shows that SK Hynix remains the clear leader in the HBM market, holding an estimated 61% share in 2025, well ahead of Samsung Electronics at 19% and Micron Technology at 20%.