Samsung to Supply HBM4 and DDR5 to AMD

According to reports, Samsung Electronics and AMD have signed a memorandum of understanding (MoU) to strengthen their strategic collaboration in AI infrastructure memory solutions.

Under the agreement, Samsung will supply its next-generation high-bandwidth memory (HBM4) for AMD's upcoming Instinct MI455X AI accelerator and provide optimized DDR5 memory for AMD's sixth-generation EPYC processors. Both companies will also explore potential wafer fabrication collaborations, allowing Samsung to manufacture chips for AMD's future products.

As part of the partnership, Samsung will serve as a key HBM4 supplier for AMD’s next-generation AI GPUs. Samsung has been a primary HBM provider for AMD, delivering HBM3E chips for the MI350X and MI355X accelerators.

The MoU was announced during NVIDIA's annual GTC event, where NVIDIA CEO Jensen Huang highlighted Samsung's HBM4 chips and its growing role in AI hardware supply chains.

This collaboration reflects the intense global competition among semiconductor manufacturers to secure long-term access to advanced memory solutions. The rising demand for AI-driven computing is reshaping the industry and putting pressure on the HBM market.

Earlier this year, AMD disclosed a five-year agreement to supply AI chips worth up to $60 billion to Meta Platforms, granting Meta the option to acquire up to 10% of AMD shares. AMD signed a similar deal with OpenAI last year.

Samsung, the world's largest memory chip maker, continues to work on closing the gap with competitors in the fast-growing HBM sector. According to Counterpoint Research, Samsung holds approximately 22% of the global HBM market, while market leader SK Hynix commands 57%.