Samsung Restarts Semiconductor R&D

According to Korean media outlet ETNews, the Device Solutions (DS) division of Samsung Electronics is preparing to restart research and development as well as facility investments in next-generation semiconductor technologies, with a strategic focus on advanced NAND flash, compound semiconductors, and advanced packaging and substrates. The move signals a renewed push into long-term technology development as the company stabilizes its memory business performance.

Earlier, Samsung had prioritized restoring competitiveness in its DRAM and HBM segments, temporarily slowing progress in certain emerging technology programs. However, with memory market conditions improving in the second half of 2024, DRAM yield rates and HBM production utilization have recovered significantly, allowing Samsung to redirect resources toward future-oriented technologies.

In the NAND flash segment, Samsung is accelerating development of its V10 NAND technology, targeting more than 400 stacking layers, a major leap from the current mass-produced 286-layer V9 NAND. The advancement is expected to significantly increase storage density per wafer, aligning with rising demand for high-capacity memory in AI-driven workloads. Following the mass production of the V9 NAND TLC version in April 2024, NAND technology iteration had slowed, but the renewed R&D effort is expected to reinforce Samsung’s technological leadership in the flash memory market.

In compound semiconductors, Samsung is expanding its production roadmap for gallium nitride (GaN) and silicon carbide (SiC). The company plans to begin operation of its 8-inch GaN production line in the second quarter of 2026, while SiC mass production is targeted for 2028. Samsung has already started building its supply chain and equipment procurement strategy, reportedly allocating between 100 billion and 200 billion won to acquire key tools such as MOCVD systems. These investments aim to capture growth opportunities in electric vehicles and energy storage power semiconductor markets.

In addition, Samsung is strengthening its focus on advanced packaging and substrate technologies. The company is advancing packaging process development alongside substrate capacity planning to support tighter integration of high-bandwidth memory (HBM) and logic chips. This strategy is designed to enhance its competitiveness in AI semiconductor packaging, where system-level integration performance is becoming increasingly critical.