Samsung, SK hynix and Qualcomm Advance HBC Chips

According to media reports, Samsung Electronics and SK hynix are actively working with Qualcomm to advance the commercialization of high-bandwidth computing (HBC) chips, a technology aimed at addressing the growing memory and bandwidth demands of AI and high-performance computing applications.

At the Deutsche Bank 2026 Technology Conference on August 26, Qualcomm Executive Vice President Durga Malladi said he had recently traveled to South Korea to meet with two major memory manufacturers after presenting the advantages of HBC and the limitations of high-bandwidth memory (HBM) at Qualcomm’s recent Investor Day.

Samsung Electronics and SK hynix are currently advancing HBC development in parallel, with a primary focus on stacking DRAM chips. The two companies are also expected to work with TSMC to integrate the necessary technologies and advanced packaging processes.

The collaboration highlights growing industry interest in alternative memory architectures as AI workloads continue to increase demand for higher memory bandwidth, improved performance, and greater power efficiency. If successfully commercialized, HBC could become an important technology for next-generation AI accelerators and high-performance computing systems.