Qualcomm Launches Two Dragonwing Processors for Edge AI

According to Qualcomm Technologies, the company announced on September 1 the launch of the Qualcomm Dragonwing™ Q-2390 and IQ-2390 processors, expanding its Dragonwing portfolio with highly integrated platforms designed to bring AI-powered edge computing to a broader range of consumer, commercial, and industrial devices.

The Dragonwing Q-2390 is designed for commercial, enterprise, and consumer IoT applications where performance, power consumption, cost, and compact size are critical considerations. The platform integrates application processing, on-device AI, camera and display support, LTE Cat 4, GPS, wired and wireless connectivity, security features, and extensive I/O. Target applications include point-of-sale terminals, self-service kiosks, access-control systems, smart appliances, smart agriculture equipment, home robots, fitness devices, and enterprise terminals.

The Dragonwing IQ-2390 is the first processor in Qualcomm's new IQ2 series of industrial edge AI processors. It combines application processing, machine vision, AI acceleration, and dual Gigabit Ethernet with Time-Sensitive Networking (TSN), targeting industrial automation, energy, utilities, and oil and gas applications. The processor is designed for compact edge systems such as HMIs, PLCs, gateways, industrial vision systems, building automation platforms, and energy management solutions. It supports an extended operating temperature range of -30°C to +115°C and features designed for environments subject to vibration and shock.

Both processors feature a quad-core Qualcomm® Kryo™ CPU, Qualcomm® Adreno™ 704 GPU, and a real-time RISC-V microcontroller (MCU). They also support Linux, Android, and Zephyr OS, giving developers greater flexibility when building connected edge devices.

Qualcomm said system-on-module (SOM) solutions based on the Dragonwing Q-2390 and IQ-2390 will be demonstrated at IFA 2026. Customer engagements have already begun through an early access program, while evaluation kits for both platforms are expected to become available in early 2027.