SK Hynix May Tap Intel for HBM4E Base Dies

According to reports cited by The Korea Herald on September 1 via social media platform X, South Korean memory chipmaker SK Hynix is considering diversifying the supply of base dies used in high-bandwidth memory (HBM) products. The company is reportedly evaluating whether to outsource part of its base die production to Intel Foundry starting with its seventh-generation HBM product, HBM4E, instead of relying entirely on TSMC.

The HBM base die, also known as the logic die, is located at the bottom of the HBM stack beneath the core dies. It serves as a control and interface layer, managing the overall structure and enabling high-speed data communication between HBM and external processors such as GPUs and CPUs.

Before HBM3E, SK Hynix produced its own base dies using internal manufacturing processes. However, as HBM technology has evolved, the logic and control functions handled by the base die have become increasingly important, placing higher demands on its performance. As a result, SK Hynix began working with TSMC to manufacture base dies for HBM4.

The SK Hynix HBM4 currently in mass production uses base dies manufactured by TSMC on a 12nm-class process. However, the relatively high manufacturing cost has become a concern. According to industry sources, TSMC-produced HBM4 base dies cost approximately three to four times more than the core dies manufactured by SK Hynix using its 10nm-class fifth-generation, or 1b, process.

The cost burden of base dies is expected to increase further with the transition to HBM4E. Since HBM products are often supplied under long-term agreements (LTAs), rising foundry costs cannot necessarily be passed on to customers immediately through higher product prices.

Industry observers therefore believe that if Intel Foundry becomes an additional manufacturing partner for SK Hynix's base dies, the company could gain greater flexibility in both cost management and supply stability. Diversifying production capacity could also give SK Hynix more options as demand for advanced HBM continues to grow.