U.S. production expansion boosts demand for packaging and testing business, and Malaysia may directly benefit

Chairman of the Malaysian Semiconductor Industry Association (MSIA) Wang Shoutai said recently that the implementation of the US "Chip and Science Act" will benefit Malaysia, which occupies 13% of the global packaging and testing market.

Wang Shoutai believes that after a series of advanced process fabs located in the United States are completed and put into operation, there will be greater demand for packaging and testing. From this perspective, Malaysia, which has a solid foundation in the field of packaging and testing, will directly benefit.

In the front-end manufacturing process, there is currently no advanced process fab in Malaysia. Wang Shoutai called on the Malaysian government to strive to attract more wafer manufacturing projects to settle in the local area while strengthening its existing advantages in the field of packaging and testing, thereby driving the local chip design industry. develop.

Wang Shoutai also proposed that the global minimum tax (GMT) regulatory reform may be implemented, this mechanism will greatly reduce the attractiveness of tax incentives to multinational companies, and how to more effectively absorb foreign capital will be an urgent issue.