TSMC: 3nm chips will be mass-produced in the second half of this year, customer products will come out next year

On August 18, Chen Fang, deputy director of TSMC, said at the 2022 World Semiconductor Conference that 3nm chips will be mass-produced in the second half of this year and have been delivered to some mobile and HPC (high-performance computing) customers. The current use of 3nm chips, products will be available next year.

Semiconductor equipment manufacturers have said that judging from the trial production of TSMC's N3 process, it is expected that after entering mass production in September, the initial yield performance will be better than the initial stage of the previous 5nm (N5) process.

On the 4th of this month, some media said that it is predicted that TSMC's 3nm expansion scale will be reduced, and the original 3nm expansion scale in 2023 may reduce the monthly production of 10,000 to 15,000 pieces. In this regard, TSMC emphasized that the capacity expansion project is proceeding as planned.