
According to recent comments to investment bank KeyBanc, Naga Chandrasekaran, Intel’s chief technology and operations officer and general manager of Intel Foundry, said the company expects its upcoming Intel 14A process to perform within 5% of TSMC’s A14 process. The statement has drawn attention to the competition between the two companies at the 1.4nm-class process node, with both technologies expected to enter the market around 2028. However, Chandrasekaran did not clarify whether Intel 14A would be ahead of or behind TSMC A14 by up to 5%.
Intel 14A is designed to use second-generation RibbonFET transistors and second-generation PowerDirect backside power delivery technology. Compared with Intel 18A, Intel expects 14A to deliver 15% to 20% higher performance at the same power, or reduce power consumption by 25% to 35% at the same performance.
TSMC A14 will use second-generation gate-all-around (GAA) nanosheet transistors and NanoFlex Pro technology. Compared with its N2 process, A14 is expected to provide 10% to 15% higher speed at the same power, or 25% to 30% lower power consumption at the same frequency, along with an approximately 20% increase in logic density.
Production schedules are also moving closer. TSMC is reportedly targeting A14 pilot production in the first quarter of 2027, while Intel’s current roadmap calls for Intel 14A risk production in the second half of 2027 and high-volume manufacturing in 2028. Intel CEO Lip-Bu Tan has also indicated that risk production could potentially begin earlier.
Beyond transistor performance, factors such as yield, manufacturing costs, production capacity, customer adoption, and manufacturing stability will also influence the commercial competitiveness of the two processes. As Intel 14A and TSMC A14 move toward production, their development is expected to remain closely watched across the global semiconductor industry.