GlobalFoundries Signs Silicon Interposer Deal with TSMC

According to an announcement on October 8, 2026, GlobalFoundries (GF) has reached a manufacturing agreement with Taiwan Semiconductor Manufacturing Company (TSMC) to establish a U.S.-based source of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem.

Under the agreement, GlobalFoundries will provide manufacturing services and expand production capacity at its Malta facility in New York to meet growing demand for high-performance computing (HPC) and artificial intelligence (AI) systems. The agreement establishes a framework for gradually scaling manufacturing capacity in line with customer demand.

GlobalFoundries plans to increase production at its Malta facility and establish the first U.S.-based source of silicon interposers to support advanced packaging technologies, including embedded deep trench capacitor components. The additional capacity is expected to provide greater scale and flexibility for delivering advanced packaging solutions across multiple product generations.

“Advanced packaging is becoming increasingly critical to achieving the performance, power efficiency, and scale required for next-generation AI systems,” said Ed Kaste, senior vice president of CMOS business at GlobalFoundries. He added that leveraging the company’s established U.S. manufacturing footprint would create a secure and scalable domestic source of critical advanced packaging components, helping customers accelerate innovation and strengthen the semiconductor supply chain.

Production ramp-up is expected to begin in the first half of 2028 at GlobalFoundries’ Malta facility. The agreement has an initial term of five years and provides a framework for potential capacity expansion in the future.