Xiaomi debuts XRING O1 and T1 chips, showcasing breakthroughs in 3nm SoC and 4G watch chip tech, marking a leap in self-developed chip design.

NVIDIA forms an 800V HVDC power alliance to boost AI data center efficiency, enabling 1MW server racks with advanced semiconductor and power technologies.

Discover the API Delevan DC780R-472L power line choke: 4.7µH inductance, 11.4A current, ferrite core. Explore its specifications, datasheet, applications, and key features here.

Discover what RF filters are, their types, working principles, and key roles in 5G, IoT, and wireless communication for better signal quality and system performance.

Wolfspeed plans to file for bankruptcy amid $6.5B debt, with stock plunging over 70%. SiC pioneer faces pressure from weak demand and fierce competition.

Learn to how to build your own 2KV no-inductor high-voltage tester for safe, efficient, and accurate component withstand voltage testing in DIY electronics.

SK Hynix unveils 321-layer 1Tb TLC 4D NAND-based UFS 4.1 storage, enhancing speed, efficiency, and AI processing in ultra-thin next-gen smartphones.

SMYG LIMITED share: Grain Buds solar term reflects China's chip momentum as Xiaomi breaks ground with 3nm tech and NVIDIA exits Hopper chip market.

AMD launches Ryzen Threadripper 9000 series with Zen 5 architecture, up to 96 cores, 128 PCIe 5.0 lanes, and DDR5-6400 support, available starting July.

Discover the Freescale MC68332ACEH16: A 32-bit ColdFire MCU with robust features, built for automotive-grade performance. Learn specs, applications & benefits.