At IEDM 2024, TSMC will unveil its 2nm process for AI and HPC, while Intel highlights RibbonFET scaling and plans for future semiconductor advancements.

Discover how a toy-level mini quadrotor FPV camera module enables Wi-Fi video transmission for smartphone-controlled cars and easy item retrieval.

ASML reports lower-than-expected Q3 orders, revises 2025 sales forecast downward, and cites delayed EUV demand, impacting stock and semiconductor market performance.

Major chipmakers are adopting TSMC's 3nm process, driving revenue growth next year as AI chips flood the market with innovative technology advancements.

Discover the Freescale i.MX 7Dual (MCIMX7D5EVM10SD) and its powerful features, specifications, datasheet, and diverse applications in modern electronics.

Explore polymer capacitors—key components in electronics. Learn about their types, working principles, advantages, and applications across various industries.

China’s 6-inch SiC substrate prices may fall to $400, prompting concerns of oversupply and potential industry consolidation by mid-2025.

Explore how to build a music spectrum analyzer using VFD technology and the STM32F303CCT6 for enhanced audio signal processing and weather data integration.

MediaTek and NVIDIA are partnering to develop Arm-based AI PC chips, aiming to rival Intel and AMD’s x86 processors. Mass production begins in 2025 using TSMC's 3nm process.

Samsung Electronics reduces its HBM production target to 170,000 units per month amid delays, adjusting strategy in response to market conditions.