ASE secures significant TSMC CoWoS orders amid rising NVIDIA AI chip demand, with AMD also pursuing advanced packaging solutions from ASE.

Discover the new portable msiSDR Malachite receiver with wide frequency range, advanced features, and USB connectivity for custom SDR builds.

Top semiconductor firms, including SK Hynix, secure major U.S. investment. SK Hynix gets $4.5B to build a new Indiana facility, boosting AI chip production.

Samsung launches the world's thinnest 12nm LPDDR5X DRAM, enhancing performance and efficiency with a 0.65mm packaging for mobile and AI applications.

Discover the Socle PC357N4J000F optocoupler, featuring 1-channel transistor output, high isolation voltage, and versatile applications. Learn about its key features, datasheet, and specifications.

Discover how satellite positioning modules work, their high-precision capabilities, and their impact on modern electronics, from automotive to mobile devices.

Intel receives its second High NA EUV machine from ASML, valued at $383M, to boost next-gen chip production, marking a significant tech advancement in their Oregon facility.

Discover the design of a powerful audio amplifier using 128 parallel 5532 op-amps for superior sound quality and efficient thermal management.

Murata Manufacturing reports strong Q2 2024 results with revenue and profit growth, expecting MLCC capacity utilization to reach 90% in Q3 due to high demand.

Mediatek Dimensity 9400 SoC is set for an October 2024 release, with a projected 50% revenue increase this year, featuring advanced AI and performance enhancements.