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HSB05-171711

HEAT SINK, BGA, 17 X 17 X 11.5 M
HSB05-171711
CUI Devices
Quantity
Unit Price:$ 0.54
Total Price:$
QuantityUnit Price
1 +$ 0.54
10 +$ 0.5135
25 +$ 0.4998
50 +$ 0.4863
100 +$ 0.4593
250 +$ 0.43228
500 +$ 0.40526
1000 +$ 0.378245
5000 +$ 0.364735
Not the price you want? Send RFQ Now and we'll contact you ASAP. Inquire for More Quantity
Product Details
Data Sheet
Guarantees
Shipping
Product AttributeAttribute Value
Product StatusActive
TypeTop Mount
Package CooledBGA
Attachment MethodAdhesive
ShapeSquare, Pin Fins
Length0.669" (17.00mm)
Width0.669" (17.00mm)
Diameter-
Fin Height0.453" (11.50mm)
Power Dissipation @ Temperature Rise3.1W @ 75°C
Thermal Resistance @ Forced Air Flow8.40°C/W @ 200 LFM
Thermal Resistance @ Natural23.91°C/W
MaterialAluminum Alloy
Material FinishBlack Anodized
Frequently Asked Questions
| Are the HSB05-171711 price and stock displayed on the platform accurate?
HSB05-171711 inventory fluctuates greatly and cannot be updated in time, it will be updated periodically within 24 hours. After submitting the order, it is recommended to confirm the order with smbom salesperson or online customer service before payment.
| What if I don't get business or technical support in time?
Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, Our technical engineers will help you with HSB05-171711 pinout information, replacements, datasheets in pdf, programming tools, starter kits and more.
| What are the specific procedures for delivery?
Once payment has been confirmed and received you will see that the order status will change to "wait for delivery". We will then reach out to you and directly to arrange the delivery, requesting delivery address, contact details and updating you on the delivery timeline. Once delivery has been setup the status will be adjusted to "wait for the receipt".