Bergquist
Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | SP600-105THERM PAD 36.83MMX21.29MM GREEN | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： |  | |||
| SPK10-0.006-00-22THERM PAD 15.87MMX5.08MM BEIGE | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| SPK10-0.006-00-105THERM PAD 36.83MMX21.29MM BEIGE | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-05THERM PAD 41.91MMX28.96MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-02THERM PAD 45.21MMX31.75MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-22THERM PAD 15.87MMX5.08MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-25THERM PAD 25.4MMX6.6MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-105THERM PAD 36.83MMX21.29MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-43THERM PAD 19.05MMX12.7MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| CPU .63X.63THERM PAD 16MMX16MM TAN | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | |
Manufacturers introduction
