Bergquist
Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | CPU 1.75X1.75THERM PAD 44.45MMX44.45MM TAN | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： |  | |||
| CPU 1.375X1.375THERM PAD 34.93MMX34.93MM TAN | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| SP600-86THERM PAD 39.62MMX26.67MM GREEN | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-86THERM PAD 39.62MMX26.67MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| SPK10-0.006-00-48THERM PAD 25.4MMX25.4MM BEIGE | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-34THERM PAD 25.4MMX19.05MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| SPK10-0.006-00-36THERM PAD 38.1MMX19.05MM BEIGE | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-36THERM PAD 38.1MMX19.05MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| SPK10-0.006-00-30THERM PAD 31.75MMX17.78MM BEIGE | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | | |||
| Q3-0.005-00-30THERM PAD 31.75MMX17.78MM BLACK | Category：Thermal - Pads, Sheets Manufacturer：Bergquist(贝格斯) Package： Packaging： | |
Manufacturers introduction
