Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W25Q32JVDAIQIC FLASH 32MBIT SPI/QUAD 8DIP | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：PDIP-8 Packaging：Tube |  | |||
| W25Q128JVEIMIC FLASH 128MBIT SPI/QUAD 8WSON | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：WSON-8(8x6) Packaging：Tube | | |||
| W948D6KBHX5IIC DRAM 256MBIT PARALLEL 60VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-60(8x9) Packaging：Tray | | |||
| W988D6FBGX7EIC DRAM 256MBIT PARALLEL 54VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-54(8x9) Packaging：Pallet | | |||
| W988D6FBGX6IIC DRAM 256MBIT PARALLEL 54VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-54(8x9) Packaging：Pallet | | |||
| W632GU8NB-11IC DRAM 2GBIT PARALLEL 78VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-78(8x10.5) Packaging：Tray | | |||
| W632GG6NB-11IC DRAM 2GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-96(7.5x13) Packaging：Tray | | |||
| W631GU6MB11IIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-96(7.5x13) Packaging：Tray | | |||
| W9825G6JB-6IC DRAM 256MBIT PARALLEL 54TFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TFBGA-54(8x8) Packaging：Pallet | | |||
| W989D6DBGX6IIC DRAM 512MBIT PARALLEL 54VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-54(8x9) Packaging：Pallet | |
Manufacturers introduction
