Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W949D6DBHX5I TRIC DRAM 512MBIT PARALLEL 60VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-60(8x9) Packaging：Reel |  | |||
 | W25Q80DLZPIG TRIC FLSH 8MBIT SPI/QUAD I/O 8WSON | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：WSON-8(6x5) Packaging：Tape | | |||
 | W9751G8NB-25 TRIC DRAM 512MBIT PARALLEL 60VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-60(8x9.5) Packaging：Reel | | |||
 | W29N01HVDINA TRIC FLASH 1GBIT PARALLEL 48VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-48(8x6.5) Packaging：Reel | | |||
 | W25Q80EWSNIGIC FLASH 8MBIT SPI 104MHZ 8SOIC | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：SOIC-8 Packaging：Tube | | |||
 | W94AD6KBHX5IIC DRAM 1GBIT PARALLEL 60VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-60(8x9) Packaging：Tray | | |||
 | W949D2DBJX5EIC DRAM 512MBIT PARALLEL 90VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-90(8x13) Packaging：Pallet | | |||
| W25Q64FWSTIGIC FLASH 64MBIT SPI 104MHZ 8VSOP | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VSOP-8 Packaging：Tube | | |||
 | W9816G6JH-6IIC DRAM 16MBIT PAR 50TSOP II | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：TSOPII-50 Packaging：Pallet | | |||
 | W631GG8MB-11IC DRAM 1GBIT PARALLEL 78VFBGA | Category：Pre-ordered Chips Manufacturer：WINBOND(华邦) Package：VFBGA-78(10.5x8) Packaging：Pallet | |
Manufacturers introduction
